Institut für Werkstofftechnik und Kunststoffverarbeitung (IWK)

RIBF - 1st Rapperswil International Bonding Forum

Welcome to the website of RIBF 2018, 1st Rapperswil International Bonding Forum

This conference will take place in Rapperswil, Switzerland, 27th June 2018. The conference will be held at the HSR, University of applied Sciences Rapperswil and is chaired by the head of Joining Technology at the IWK, Institute for Materials Technology and Plastics Processing, Pierre Jousset.


This first one-day conference has been planned with the aim to bring together engineers and researchers from the industry, engineering schools and universities, to exchange about the state of the art and the latest innovations in the field of bonding technology. The contents of the conference focuses on applied research and industrial applications.


The conference covers the following topics of the science and technology of adhesion and adhesives:

  • Adhesive bonding technology for engineering applications
  • Adhesive joint designs – industrial applications and innovations
  • Mechanical properties of adhesive bonded joints:

    •  Experimental studies
    • Numerical studies/FE Simulation
    • Durability, Fatigue, Crash

  • Adhesion and surface treatment
  • Quality procedures and standardisation

Oral Presentation and Posters

Oral Presentation:

Authors who wish to make an oral presentation are requested to submit an abstract (Up to two A4 pages possibly with a diagram or picture and references) in English, by 31st March 2018. The abstracts should be sent electronically to



Authors who wish to submit a poster are requested to mention it during their registration.


The maximum size of the poster is A0 (841 mm x 1189 mm) in portrait. The text and illustrations should be readable from at least 2 m.


Technical equipment to hang of posters will be provided by the conference’s organisation committee on the day of the conference.


The poster board number assigned to your poster will be indicated on the final program. Your poster should be displayed at the place indicated by the number in the final program.

Download Formatting Instructions - MS Word


To register for the RIBF 2018, please fill in the electronic registration form. Each participant including those having an oral presentation or a poster, is expected to pay the corresponding registration fee.


Registration fee:

390 CHF


The conference fee includes the proceedings with the accepted abstracts (USB Stick), lunch, coffee-breaks, reception aperitif on 26th June 2018 and aperitif at the end of the conference on 27th June 2018.


A bill will be send to you aprox. 2 weeks after your online registration.


Registration Deadline:

31st Mai 2018


Registration form:

Click here.


Cancelation Policy:

In case of cancellation, a written notification should be sent to the conference chairman. If it is received prior to May 31st, 2018, registration fees will be refunded with a deduction of 100 CHF. No refund can be made after May 31st, 2018.

Important dates and deadlines

    • 15th April March 2018: Registration for oral presentation deadline
    • 1st Mai 2018: Notification of acceptance to authors
    • 15th Mai 2018: Publication of the final program of the conference
    • 31st Mai 2018: Registration deadline
    • 27th June 2018: 1st Rapperswil International Bonding Forum

      Conference Chairman

      Prof. Dr. Pierre Jousset

      Head Joining Technology

      Email: pierre.jousset(at)

      Phone (Direct): +41 (0)55 222 40 53


      IWK Institute for Materials Technology and Plastics Processing

      HSR, University of applied Sciences HSR Rapperswil


      Adress: Oberseestrasse 10, Postfach 1475, CH-8640 Rapperswil, Switzerland

      Tel: +41 (0)55 222 47 70

      Fax: +41 (0)55 222 47 69





      Customer event 12. Rapperswiler Kunststoff-Forum
      Plenary Session 11. Rapperswiler Kunststoff-Forum
      The Joining Technology Team of the IWK
      The beautiful campus of the HSR in Rapperswil, Switzerland